News

  • 2012/08/22

    Low-pessure mould capping / encapsulation Technology AT Kun Shan Vensik Electronics Co., Ltd.

新增網頁2

Low-pessure mould capping / encapsulation Technology



Machine for low-pressure capping / encapsulation moulding

 
                                  Before                                                               After

NOTE:
After our low-pessure encapsulation moulding, the PCBoard or other components inside the mould will be completely encapsulated and sealed without and damange geenrally caused by high-pressure encapsulation process. 

Back