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  • 2012/08/22

    Low-pessure mould capping / encapsulation Technology AT Kun Shan Vensik Electronics Co., Ltd.

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Low-pessure mould capping / encapsulation Technology



Machine for low-pressure capping / encapsulation moulding

 　
                                  Before                                                               After

NOTE:
After our low-pessure encapsulation moulding, the PCBoard or other components inside the mould will be completely encapsulated and sealed without and damange geenrally caused by high-pressure encapsulation process.　

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Vensik Electronics Co., Ltd.
No.86, Xinmin St., Nangang Dist., Taipei City 115, Taiwan R.o.c.
Tel : 886-2-27833836    Fax : 886-2-27824427

Contact Person : Miss Cindy Yao / Mr. Tony Chueh
E-Mail : vensik@vensik.com.tw ( Headquarter, Taiwan )
URL : http://www.vensik.com.tw